Intel Thermal Solution BXSTS300C,Combo Heatsink /w fan LGA3647
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The Intel STS300C LGA3647 Passive/Active Combination Heatsink (BXSTS300C) provides efficient heat dissipation for processors that belong in the Intel Skylake-EX and Intel Skylake-SP CPU series. The Intel STS300C heatsink implements both passive and active components to cool server-grade CPUs. It comes with a high-quality fan and a durable heatsink with superior heat-conducting heat pipes.
By implementing both a passive and active heatsink architecture, the STS300C provides top-of-the-line cooling performance for entry-level and mid-tier Intel server systems. Its compact size and shape make it easy to install on motherboards outfitted with an LGA3647 socket. The included fan allows easy detachment for maintenance or replacement when needed. It supports processors that have 280-Watt Thermal Design Power (TDP).
The Intel STS300C passive/active combination heatsink with its compact 91mm x 88mm x 64mm dimensions means that it can easily be used with any compatible Intel server chassis. It is easy to install on server boards that have an LGA3647 CPU socket. Use it to ensure optimum performance and prevent overheating your equipped Intel Xeon processor.