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Buy Kingston 32gb Ddr4 2rx8 4g X 72-bit Pc4-2666 Cl19 288-pin 1.2v Dimm Ecc Memory Module

Kingston 32gb Ddr4 2rx8 4g X 72-bit Pc4-2666 Cl19 288-pin 1.2v Dimm Ecc Memory Module

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$279
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Kingston 32GB DDR4 2Rx8 4G x 72-Bit PC4-2666 CL19 288-Pin 1.2V DIMM ECC memory module Kingston\'s KSM26ED8/32ME is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, ECC, memory module, based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: • Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Dual-rank • On-board I2 serial presence-detect (SPD) EEPROM • Temperature sensor with integrated SPD • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23\' (31.25mm) • RoHS Compliant and Halogen-Free
279 279 AUD 100
SKU
KSM26ED8/32ME
SKU#: KSM26ED8/32ME / ITEM NO: 815800 / BRAND: Kingston
Rating:
$279.00
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Kingston 32GB DDR4 2Rx8 4G x 72-Bit PC4-2666 CL19 288-Pin 1.2V DIMM ECC memory module Kingston's KSM26ED8/32ME is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, ECC, memory module, based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: • Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Dual-rank • On-board I2 serial presence-detect (SPD) EEPROM • Temperature sensor with integrated SPD • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23' (31.25mm) • RoHS Compliant and Halogen-Free

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Kingston 32GB DDR4 2Rx8 4G x 72-Bit PC4-2666 CL19 288-Pin 1.2V DIMM ECC memory module Kingston's KSM26ED8/32ME is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, ECC, memory module, based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: • Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Dual-rank • On-board I2 serial presence-detect (SPD) EEPROM • Temperature sensor with integrated SPD • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23' (31.25mm) • RoHS Compliant and Halogen-Free
Kingston 32GB DDR4 2Rx8 4G x 72-Bit PC4-2666 CL19 288-Pin 1.2V DIMM ECC memory module Kingston's KSM26ED8/32ME is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, ECC, memory module, based on eighteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: • Power Supply: VDD = 1.2V Typical • VDDQ = 1.2V Typical • VPP = 2.5V Typical • VDDSPD = 2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Dual-rank • On-board I2 serial presence-detect (SPD) EEPROM • Temperature sensor with integrated SPD • 16 internal banks; 4 groups of 4 banks each • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) • Selectable BC4 or BL8 on-the-fly (OTF) • Fly-by topology • Terminated control command and address bus • PCB: Height 1.23' (31.25mm) • RoHS Compliant and Halogen-Free

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