ASUS WS X299 PRO/SE X-SERIES X299 Motherboard
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$836
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SKU
WS X299 PRO/SE
SKU#: WS X299 PRO/SE / ITEM NO: 581207 / BRAND: Asus
$836.00
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Intel LGA 2066 ATX motherboard with DDR4 4133MHz, dual M.2 and M.2 heatsink, U.2, USB 3.1 Gen 2 connectors, ASMB9-iKVM and ASUS Control Center.
ASUS Control Center: A software utility that provides convenient, secure and cost-saving centralized IT management for small and medium businesses.
ASMB9-iKVM (BMC) : supports remote BIOS updates, fans control, standalone KVM, video recording, and BSOD capture, providing around-the-clock remote monitoring and diagnostics through remote console (Web GUI & CLI)
Ultra-efficient VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance.
Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections.
CPU
Build in Intel® Socket 2066 Core™ X-Series Processors
* Refer to www.asus.com for CPU support list
Chipset
Build in Intel® X299
Memory
Intel® Core™ X-series Processors (6-core above)
8 x DIMM, Max. 128GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
Intel® Core™ X-series Processors (4-core)
4 x DIMM, Max. 64GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
* Please refer to ASUS AVL for the latest update.
* Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.
Multi-GPU Support
Supports NVIDIA® 3-Way SLI™ Technology *
Supports AMD 3-Way CrossFireXâ„¢ Technology *
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Please refer to Manufacturer SKU for the exact details
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Intel LGA 2066 ATX motherboard with DDR4 4133MHz, dual M.2 and M.2 heatsink, U.2, USB 3.1 Gen 2 connectors, ASMB9-iKVM and ASUS Control Center.
ASUS Control Center: A software utility that provides convenient, secure and cost-saving centralized IT management for small and medium businesses.
ASMB9-iKVM (BMC) : supports remote BIOS updates, fans control, standalone KVM, video recording, and BSOD capture, providing around-the-clock remote monitoring and diagnostics through remote console (Web GUI & CLI)
Ultra-efficient VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance.
Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections.
CPU
Build in Intel® Socket 2066 Core™ X-Series Processors
* Refer to www.asus.com for CPU support list
Chipset
Build in Intel® X299
Memory
Intel® Core™ X-series Processors (6-core above)
8 x DIMM, Max. 128GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
Intel® Core™ X-series Processors (4-core)
4 x DIMM, Max. 64GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
* Please refer to ASUS AVL for the latest update.
* Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.
Multi-GPU Support
Supports NVIDIA® 3-Way SLI™ Technology *
Supports AMD 3-Way CrossFireXâ„¢ Technology *
Intel LGA 2066 ATX motherboard with DDR4 4133MHz, dual M.2 and M.2 heatsink, U.2, USB 3.1 Gen 2 connectors, ASMB9-iKVM and ASUS Control Center.
ASUS Control Center: A software utility that provides convenient, secure and cost-saving centralized IT management for small and medium businesses.
ASMB9-iKVM (BMC) : supports remote BIOS updates, fans control, standalone KVM, video recording, and BSOD capture, providing around-the-clock remote monitoring and diagnostics through remote console (Web GUI & CLI)
Ultra-efficient VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance.
Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections.
CPU
Build in Intel® Socket 2066 Core™ X-Series Processors
* Refer to www.asus.com for CPU support list
Chipset
Build in Intel® X299
Memory
Intel® Core™ X-series Processors (6-core above)
8 x DIMM, Max. 128GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
Intel® Core™ X-series Processors (4-core)
4 x DIMM, Max. 64GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
* Please refer to ASUS AVL for the latest update.
* Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.
Multi-GPU Support
Supports NVIDIA® 3-Way SLI™ Technology *
Supports AMD 3-Way CrossFireXâ„¢ Technology *