Gigabyte GeForce RTX™ 5060 Ti WINDFORCE 16G, 2572 MHz, CUDA TBD, 28 Gbps, GDDR7, 128 bit, PCI-E 5.0, PSU 650W, DisplayPort 2.1b *3 HDMI 2.1b *1 SPECIFICATION Graphics Processing GeForce RTX™ 5060 Ti Core Clock 2572 MHz CUDA® Cores TBD Memory Clock 28 Gbps Memory Size 16 GB Memory Type GDDR7 Memory Bus 128 bit Card Bus PCI-E 5.0 Digital max resolution 7680x4320 Multi-view 4 Card size L=208 W=120 H=40 mm PCB Form ATX DirectX DirectX 12 API OpenGL 4.6 Recommended PSU 650W Power Connectors 8 Pin*1 Output DisplayPort 2.1b *3 HDMI 2.1b *1 Accessories Quick guide FEATURES Powered by the NVIDIA Blackwell architecture and DLSS 4 Powered by GeForce RTX™ 5060 Ti Integrated with 16GB GDDR7 128bit memory interface WINDFORCE cooling system Hawk fan Server-grade Thermal conductive gel Reinforced structure The Ultimate Platform for Gamers and Creators Fifth-Gen Tensor Cores Max AI performance with FP4 and DLSS 4 New Streaming Multiprocessors Optimized for neural shaders Fourth-Gen Ray Tracing Cores Built for Mega Geometry WINDFORCE COOLING SYSTEM The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a copper plate, 3D active fans, and screen cooling. HAWK FAN The Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics. GRAPHENE NANO LUBRICANT Graphene nano lubricant can extend the life of sleeve bearing fan by 2.1 times, close to the life of double ball bearing, and is quieter. ALTERNATE SPINNING Reduce the turbulence of adjacent fans and increase airflow pressure. 3D ACTIVE FAN The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game. SERVER-GRADE THERMAL CONDUCTIVE GEL To enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads. COPPER PLATE & COMPOSITE COPPER HEAT PIPE The copper plate directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink. SCREEN COOLING Extended heatsink allows air to pass through, providing better heat dissipation. REINFORCED STRUCTURE The reinforced metal backplate securely fastened to the I/O bracket, provides exceptional structural integrity.

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